Ultrafine Boron Carbide Micro Powder W1-W0.5
Submicron boron carbide powder, particle size W1-W0.5, for precision polishing and semiconductor processing
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Product Details
Product Specifications
| grit number | D50 (μm) | B4C Content (%) |
|---|---|---|
| Week 1 | 1.0±0.2 | 90-92.5 |
| W0.5 | 0.5±0.1 | 90-92.5 |
Product Features
- Ultra-fine: Submicron-grade fine powder
- Narrow particle size distribution: uniform particle size
- High Purity: B4C content ≥ 90%
- Excellent dispersion: Resists agglomeration
Application Areas
- Semiconductor Wafer Polishing
- Precision Polishing of Optical Glass
- Sapphire substrate processing
- High-Precision Ceramic Polishing